Flip Chip Packaging Substrate Manufacturing
May 30, 2023 ⚊ 1 Min read ⚊ Views 60 ⚊ BLOGFlip Chip Packaging Substrate Manufacturing. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Such as: 10 layer Package Substrates. 12 Layer Package Substrates. 14 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a substrate with less than 10 layers. We have used the Msap technology to produce the track width/spacing with 12um/12um.
Tags: FC-BGA Substrates manufacturer