Flip Chip Packaging Substrate Manufacturing

May 30, 2023 1 Min read Views 60 BLOG

Flip Chip Packaging Substrate Manufacturing. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Such as: 10 layer Package Substrates. 12 Layer Package Substrates. 14 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a substrate with less than 10 layers. We have used the Msap technology to produce the track width/spacing with 12um/12um.

Tags: FC-BGA Substrates manufacturer

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